JPH0229529U - - Google Patents
Info
- Publication number
- JPH0229529U JPH0229529U JP10716488U JP10716488U JPH0229529U JP H0229529 U JPH0229529 U JP H0229529U JP 10716488 U JP10716488 U JP 10716488U JP 10716488 U JP10716488 U JP 10716488U JP H0229529 U JPH0229529 U JP H0229529U
- Authority
- JP
- Japan
- Prior art keywords
- integrated circuit
- hybrid integrated
- power semiconductor
- heat sink
- semiconductor element
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000011347 resin Substances 0.000 claims description 8
- 229920005989 resin Polymers 0.000 claims description 8
- 238000007789 sealing Methods 0.000 claims description 5
- 239000004065 semiconductor Substances 0.000 claims description 4
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical group [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims 1
- 229910052782 aluminium Inorganic materials 0.000 claims 1
- 229920002379 silicone rubber Polymers 0.000 claims 1
- 239000004945 silicone rubber Substances 0.000 claims 1
- 239000000758 substrate Substances 0.000 claims 1
Landscapes
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1988107164U JP2536626Y2 (ja) | 1988-08-12 | 1988-08-12 | 混成集積回路 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1988107164U JP2536626Y2 (ja) | 1988-08-12 | 1988-08-12 | 混成集積回路 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH0229529U true JPH0229529U (en]) | 1990-02-26 |
| JP2536626Y2 JP2536626Y2 (ja) | 1997-05-21 |
Family
ID=31341332
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1988107164U Expired - Lifetime JP2536626Y2 (ja) | 1988-08-12 | 1988-08-12 | 混成集積回路 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2536626Y2 (en]) |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6013745U (ja) * | 1983-07-06 | 1985-01-30 | 三洋電機株式会社 | 混成集積回路 |
-
1988
- 1988-08-12 JP JP1988107164U patent/JP2536626Y2/ja not_active Expired - Lifetime
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6013745U (ja) * | 1983-07-06 | 1985-01-30 | 三洋電機株式会社 | 混成集積回路 |
Also Published As
| Publication number | Publication date |
|---|---|
| JP2536626Y2 (ja) | 1997-05-21 |